Clamp mode package diffusion welded power SiC Schottky diodes

Korolkov, O.; Kuznetsova, N.; Rang, T. (2006). Clamp mode package diffusion welded power SiC Schottky diodes. Proceedings of the 10th Biennial Baltic Electronics Conference BEC2006: 2006 International Baltic Electronics Conference, Tallinn, Oct. 2-4, 2006. Ed. T.Rang. Tallinn: IEEE Operations Center, 55−58.
publitseeritud konverentsiettekanne
Korolkov, O.; Kuznetsova, N.; Rang, T.
  • Inglise
Proceedings of the 10th Biennial Baltic Electronics Conference BEC2006
T.Rang
2006 International Baltic Electronics Conference, Tallinn, Oct. 2-4, 2006
Tallinn
IEEE Operations Center
1736-3705
1-4244-0414-2
2006
5558
Ilmunud
3.1. Artiklid/peatükid lisas loetletud kirjastuste välja antud kogumikes (kaasa arvatud Thomson Reuters Book Citation Index, Thomson Reuters Conference Proceedings Citation Index, Scopus refereeritud kogumikud)

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